Xiamen University held the 22nd International Conference on Electronic Packaging Technology (ICEPT 2021) online from September 14 to 17, 2021. The ICEPT 2021 was hosted by Institute of Microelectronics of Chinese Academy of Sciences (IMECAS) and Xiamen University, organized by School of Electronic Science and Engineering of Xiamen University, Xiamen Semiconductor Investment Group Co., Ltd. and Beijing Faith Information Consultant Ltd. As one of the four major international conferences on electronic packaging technology, the Conference invited more than ten IEEE Fellows (Fellow of the International Institute of Electrical and Electronics Engineers) and attracted domestic and overseas universities, research institutions, electronic packaging manufacturers from over 20 countries and regions, with over 3000 attendees participating online. Dr. Yu Daquan, Chair of Technology Committee of ICEPT, professor of Xiamen University and Chairman of the Board of Xiamen Sky Semiconductor Technology Co., Ltd., hosted the opening session.

Prof. Ye Tianchun, Chair of the Conference and Vice President of China Semiconductor Industry Association, Zhang Rong, Xiamen University’s President, and Chris Bailey, Chair of IEEE Power and Energy Society and professor of the University of Greenwich, UK, respectively addressed the Conference. Attendees and speakers of the Conference included Zhang Tonglong, an IC packaging expert of HiSilicon, Lin Yaojian, R&D Vice President of JCET Group and General Manager of JCET R&D Center (China), Dr. John H Lau from Unimicron Technology Corp., Liu Sheng, Dean of School of Power and Mechanical Engineering, Wuhan University, Dr. Sun Peng, Chief Operation Officer, Chief Technician and Senior Vice President of XMC, Johan Liu, academician of Royal Swedish Academy of Engineering Sciences and professor of the  Chalmers University of Technology, Sweden, Prof. Wang Qidong, Director of System Packaging and Integration Research Center, Institute of Microelectronics, Chinese Academy of Sciences, and Prof. Katsuaki Suganuma from Osaka University, Japan.

The Conference received over 600 research papers from academia and industry worldwide, higher than any previous conference, and adopted 350 of the papers after expert review. The Conference focused on ten topics including advanced packaging, interconnection technology, packaging design and modeling, packaging materials and processes, packaging technology, quality and reliability, power electronics, optoelectronic displays, microelectromechanical sensors and the Internet of Things, and packaging in emerging fields. Nearly 100 brilliant lectures were presented in the forms of short-term training sessions, forums, conference reports, keynote speeches, reports of branch meetings, posters and exhibitions. Attendees engaged in full exchanges on technological bottlenecks, key scientific issues and the latest progress in electronic packaging and contributed valuable ideas for future development in this field.

The Conference has covered the whole electronic packaging industry with academic, commercial and industrial vision, focused on hot topics in the industry, and shared global cutting-edge semiconductor packaging and testing technology of high quality in an international and professional manner, playing a significant role in talent cultivation for China’s electronic packaging and contributing to technological exchanges in global electronic packaging.